Mold opening (Decap) and etching
Various chemicals are used as opening agents to dissolve the mold and open it.
Various chemicals are used as opening solutions to dissolve the mold and open it. Additionally, it is possible to remove passivation films and multilayer wiring. FIB processing is also available through partner companies.
- 企業：レスター 厚木事業所,熊本事業所,大分事業所,鹿児島事業所
- 価格：Other
